供应元化学WE-3008S1芯片填充胶水 WE-3008S1 is one component liquid epoxy adhesive, Application Guidelines SHIPMENT Benefits ● Fast cure ● Excellent reliability and adhesion strength Cure Heat Cure Application Underfill for BGA / CSP / WLP WE-3008S1 is packed and shipped in dry ice at-20℃. Receiving Inspection, place the entire shipment in a refrigerator. (Below -20℃) Precautions for safe handling - Keep away from sources of ignition. - No smoking - - Wear protective gloves/protective clothing/eye protection/face protection. - Wash hands thoroughly after handling. - Do not eat, drink or smoke when using this product. - Avoid inhalation of vapor, mist or gas. - Avoid contact with skin and eyes. 优点 ●低温速固话 ●对跌落冲击和热冲击有良好的 可靠性 固化形态 热固话 应用点 CSP & BGA 底部填充胶 保管 WE-3008S1必须在10℃以下保存。 明示的储存寿命只 有在材料在相应保管条件下储存时才有效。 不正确的 保管条件会导致材料的涂布和固化特性下降。